GlobalFoundries and Egis Partner on Smart Sensing Technology for Mobile and IoT
GlobalFoundries and Egis Partner on Smart Sensing Technology for Mobile and IoT
Synopsis
- GlobalFoundries teams up with Egis on direct time-of-flight sensors.
- New solution built on 55nm platform with integrated SoC features.
- Egis expands beyond fingerprint sensors into 3D sensing markets.
- Applications span smartphones, IoT, robotics, and automotive.
- Collaboration aims at smaller, faster, power-efficient devices.
5 mins Read
At its annual Technology Summit in Shanghai, GlobalFoundries confirmed a collaboration with Egis Technology to develop a new direct time-of-flight (dToF) sensor solution using its 55nm platform. The partnership is aimed at expanding smart sensing capabilities for mobile, IoT, and automotive markets.
The first-generation FSI (front-side illuminated) SPAD (single-photon avalanche diode) from them provides low Dark Count Rate and high Near-Infrared Photon Detection Probability, ensuring high-SNR performance. Available as a p-cell, the device is integrated within the 55nm platform to create a complete dToF SoC. This includes high-voltage bias, VCSEL driver, MCU, and ranging core, all on a smaller chip. Combined with GF’s IP portfolio, this allows developers to design intelligent sensors with reduced size, weight, power, and cost, and bring them to market faster.
Egis, already recognized for its display fingerprint sensors, first aligned with GF in 2022 to move into the 3D sensor segment. Applications for the new SPAD technology include laser-assisted auto focus in smartphones, laptops, and projectors, presence detection in smart appliances and buildings for energy-saving features, and collision avoidance in drones and robots.
Kamal Khouri, senior vice president of GF’s CMOS product line, noted that the FSI SPAD delivers major performance and design advantages for the next wave of intelligent sensors. He emphasized that the collaboration with them will enable advanced sensing devices to thrive in a more automated world.
Egis Chairman Steve Lo added that the partnership demonstrates their commitment to delivering innovative sensor solutions for essential markets, while leveraging GF’s advanced technology to simplify user experiences.
The 55nm SPAD is now available for mass production at GF’s Singapore facility. Designers have access to a process design kit and dedicated shuttle runs through the GlobalShuttle multi-project wafer program, enabling early prototyping.
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About GlobalFoundries
GlobalFoundries (GF) is a leading global semiconductor manufacturer recognized for delivering high-performance, energy-efficient solutions that power modern industries. Its technologies support automotive innovation, smart mobile devices, the Internet of Things, and advanced communications infrastructure. With manufacturing operations spanning the United States, Europe, and Asia, GF is trusted worldwide for reliability, long-term security, and sustainable practices. The company’s expertise enables customers to accelerate product development and achieve faster time-to-market with efficient, cost-effective designs. Every day, GF’s diverse team focuses on creating semiconductor solutions that help the world live, work, and connect securely. Learn more at www.gf.com.
About Egis Technology
Egis Technology Inc. is a global sensing solutions provider specializing in capacitive, optical, and ultrasonic sensor technologies. As a fabless semiconductor company, Egis extends its capabilities beyond sensors, offering connectivity IP and turnkey chiplet design services that help customers accelerate innovation. Its technologies are applied across mobile devices, PCs, automotive systems, and industrial markets, supporting a wide range of applications that enhance security and user interaction. With hundreds of patents worldwide, Egis is recognized for developing forward-looking, intuitive solutions that improve everyday experiences. The company’s goal is to deliver accessible, reliable, and innovative sensing products across industries.
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