QuantumDiamonds Commits Over €150M to Quantum Chip Inspection Facility
QuantumDiamonds Commits Over €150M to Quantum Chip Inspection Facility
Synopsis
- QuantumDiamonds is investing more than €150 million to build a quantum-based semiconductor metrology production facility in Munich.
- The project is expected to receive public backing under the European Chips Act and support advanced 2.5D and 3D chip architectures.
- Global demand for the company’s Quantum Diamond Microscopy systems is driving expansion across Europe, the United States, and Taiwan.
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QuantumDiamonds GmbH, a German quantum sensing company, has unveiled plans to invest more than €150 million in a new production facility dedicated to quantum-based chip inspection and metrology systems. The site, planned for eastern Munich, is expected to benefit from substantial public support from both the German federal government and the state of Bavaria under the framework of the European Chips Act, according to reporting by Tech.eu.
A spin-off from the Technical University of Munich, QuantumDiamonds develops and commercialises quantum sensing technologies used in semiconductor metrology and failure analysis. Its core product, Quantum Diamond Microscopy (QDM), is already deployed by foundries and integrated device manufacturers around the world, positioning the company within a critical segment of the global semiconductor supply chain.
The company has recently highlighted new results showing that QDM can detect internal defects in commercial package-on-package devices that remain invisible to conventional inspection methods such as lock-in thermography and CT X-ray imaging. QuantumDiamonds attributes a rise in demand for its systems to these findings. Initial system deployments have been completed across Europe, while further installations are scheduled for the first quarter of 2026 in the United States and Taiwan, supporting development and qualification activities at major semiconductor manufacturers.
QDM technology relies on nitrogen-vacancy centres in diamond to map electrical currents with micrometre-scale precision. The process is non-destructive and operates on short timescales, even within complex chip packages. QuantumDiamonds positions this capability as increasingly relevant for advanced 2.5D and 3D semiconductor architectures that underpin AI accelerators, mobile processors, and automotive electronics.
Kevin Berghoff, co-founder and chief executive of QuantumDiamonds, said the investment reflects a strategic shift toward scaled, global production. He noted that the company is focused on enabling inspection capabilities for areas of chips that were previously inaccessible, while anchoring development and manufacturing in Germany with European intellectual property and talent.
The planned Munich facility is expected to house production lines for quantum-grade diamond sensor substrates, cleanroom integration for QDM inspection systems, and joint development laboratories with semiconductor partners. It will also provide application support aimed at fab integration and inline process control, reinforcing collaboration between QuantumDiamonds and chip manufacturers.
The project has been designated as a first-of-a-kind facility under the European Chips Act. After assessing alternative locations, including Phoenix, Arizona, the company selected Germany as its industrial base, citing access to specialised expertise, a mature supply chain ecosystem, and established public–private innovation frameworks within Europe.
QuantumDiamonds has also received a start-of-works confirmation, enabling construction activities to proceed without jeopardising eligibility for future public funding. This approval allows the company to begin preparations such as equipment procurement and facility setup, marking a significant step in its expansion plans, as reported by Tech.eu.
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About QuantumDiamonds GmbH
QuantumDiamonds GmbH is a German quantum sensing company specialising in advanced semiconductor inspection and metrology technologies. Spun out of the Technical University of Munich, the company focuses on solving increasingly complex failure-analysis challenges faced by modern chipmakers as devices move toward dense, multi-layer architectures. Its core technology, Quantum Diamond Microscopy (QDM), uses nitrogen-vacancy centres in diamond to non-destructively map electrical currents inside semiconductor devices with micrometre-level precision and rapid measurement times.
QuantumDiamonds’ systems are used by foundries and integrated device manufacturers worldwide to identify internal defects that conventional techniques such as lock-in thermography and CT X-ray imaging can miss, including in advanced package-on-package designs. The company positions its technology as critical for next-generation 2.5D and 3D semiconductor architectures underpinning AI, mobile, and automotive electronics. With growing global demand, QuantumDiamonds is scaling production while anchoring development, manufacturing, and intellectual property within Europe’s semiconductor ecosystem.
Featured image Source: Tech.eu
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